Chip Packaging

Taiwan Semiconductor (NYSE:TSM) is reportedly considering expanding its advanced chip packaging capacity in Japan, which could significantly impact the global semiconductor industry. What Happened: TSMC is exploring the possibility of establishing advanced packaging facilities in Japan, sources...

Samsung Electronics Co Ltd (OTC:SSNLF), the South Korean tech titan, is eyeing to establish a chip packaging research facility in Japan. What Happened: Samsung intends to allocate approximately 40 billion yen (equivalent to $280 million) over five years for a newly proposed research facility in...